Tin Lead Solder Stick

Description:

Tin-lead solder stick is a low-melting point alloy, typically composed of tin ($\text{Sn}$) and lead ($\text{Pb}$), manufactured in a solid bar or stick form. It’s an economical and effective joining material primarily used in manual soldering applications requiring significant amounts of filler metal. The specific $\text{Sn}:\text{Pb}$ ratio dictates its melting characteristics and strength. Its excellent wettability and flow ensure reliable, electrically conductive, and mechanically strong joints. This alloy remains a standard for non-RoHS compliant electronic, plumbing, and general metal joining tasks.

Applications:

• Plumbing: Used widely for joining copper pipes and fittings, especially in older installations where lead content isn’t restricted.
• Stained Glass Work: Essential for creating the durable seams that hold together individual pieces of glass in stained glass windows and art.
• General Metal Joining: Utilized in radiators, sheet metal work, and electrical grounding connections where strength and electrical conductivity are required and a manual, high-volume solder application is necessary.

Varients:

• 60/40 $\text{Sn}/\text{Pb}$: This is a very common alloy, slightly past the eutectic point, offering good wetting and flow characteristics. Its melting range is narrow, making it popular for general electrical and plumbing work.
• 63/37 $\text{Sn}/\text{Pb}$ (Eutectic): This specific ratio melts at a single, low temperature (183∘C or 361∘F), making it ideal for electronic soldering as it minimizes the “pasty range” and thermal stress on components.