Description:
Paste flux is a thick, gelatinous chemical compound essential for all soldering and metal-joining processes. Its primary role is to chemically remove oxidized metal and other surface contaminants, which naturally hinder a strong metallurgical bond. The paste form ensures the flux remains precisely where applied, providing both an initial cleaning action and a protective barrier against re-oxidation during heating. This superior surface preparation promotes excellent wetting, allowing molten solder to flow cleanly and create reliable, high-integrity mechanical and electrical connections. Our paste fluxes are engineered for consistent viscosity and high activity to meet rigorous industry standards.
Applications:
- Electronics Rework and Repair: Used directly as a tacky flux for precision applications like Ball Grid Array (BGA) re-balling and component replacement on Printed Circuit Boards (PCBs).
- Surface Mount Technology (SMT) Reflow: The flux component in solder paste (a mix of flux and powdered solder) that holds components in place for automated stencil printing and reflow oven processing.
- General Metal Joining: Utilized in hand-soldering and brazing applications where localized, non-flowing flux application is required for plumbing, automotive, and jewelry repair.
