Description:
Lead-Free Solder Paste is a homogeneous mixture of powdered lead-free solder alloy and a flux medium, formulated for surface mount technology (SMT) applications. It is crucial in modern electronics manufacturing, replacing traditional tin-lead solders to comply with environmental regulations like RoHS (Restriction of Hazardous Substances). This paste is accurately deposited onto circuit board pads, where it holds components in place before being heated in a reflow oven. Upon heating, the flux cleans the metal surfaces and the solder powder melts and flows, forming reliable and durable electrical and mechanical connections. Its consistent rheology and long stencil life are key features ensuring high-quality, high-yield production.
